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HY810 Series 2kg Grey Thermal Grease in the Bucket
HY810 Series Nano-Based Thermal Grease, with good cooling pe...
- Model：HY810-CN2000
- Brand：HALNZIYE
- Colour：Grey
- Thermal conductivity：3.0~4.85 W/mk
- Package：2kg in the bucket
- Application：CPU, GPU, COB LED Lighting
- Thermal Impedance：0.007 ~ 0.057 °C-in2/W
- Concentration：300 ~ 350 ± 10 1/10mm
- High temperature resistance：-30 ~ 220 °C
- Operation temperature：-20 ~ 180 °C
product details
HY810 Series Grey Themral Grease
Product Description
HY810 Series Grey Thermal Grease, good performance for middle CPU and higher power COB LED Lighting, Thermal grease passed SGS, ROHS, SVHC Certificates, differen packing for your different demands.
Thermal conductivity: 3.0 ~ 4.85 w/m-k
Good Electric Insulating, Breakdown 0.5kv voltage
Low Thermal Impedance, keep grease condition with long time
With a wide range working temperature, keep stable performance at temperature
-20 ℃ ~180 ℃
High performance, saving your cost.
Specifications:
| Model | HY810/HY810A/HY810B /HY810C/HY810L | Unit |
| Color | Grey | No |
| Thermal Conductivity | 3.0 ~ 4.85 | W/m-k |
| Thermal Impedance | ＜0.007 ~ 0.057 | ℃-in²/W |
| Specific Gravity | ＞2.5 ~ 2.94 | g/cm³ |
| Thixotropic Index | 300 ~ 350 ±10 | 1/10mm |
| Moment Bore Temperature | -30~220 | ℃ |
Operation Temperature | -20~180 | ℃ |
Ingredients
| Silicone Compounds | 15 ~ 30 | % |
| Carbon Compounds | 25 ~ 35 | % |
| Metal Oxide Compound | 40 ~ 57 | % |
Product Applications
High thermal Demand module
Cooling device to the end plate or between the Frame
Automotive Engine Control
Middle CPU, GPU
Power conversion apparatus
Notebook and desktop computers
Network communications equipment
Household appliances, electronic components, electrical etc.
Application Method
1. Clean the CPU and heat sink surface, wipe the surface lightly with a cotton ball or cotton seab dampened with our thermal cleanser.
2. Place a tiny drop of thermal grease to the center of the cooler base, smear it evenly with scraper, best thickness is 0.13~0.15mm.
3. Attach the heat sink to the processor and avoid removing the heat sink after installing it.
4. Finished
Product Storage
Room temperature
